Dongsoo Lee received the B.S. and M.S. degrees in electrical engineering from the Korea Advanced Institute of Science and Technology, Daejeon, Korea, and the Ph.D. degree in electrical and computer engineering from Purdue University, West Lafayette, IN, USA, in 2002, 2004, and 2013, respectively. He was with Samsung Electronics Ltd., Suwon, Korea, from 2004 to 2008, where he was involved in research on designing circuits for DTV one-chip solutions. In 2011, he was a Graduate Intern with Qualcomm Incorporated, San Diego, CA, USA, and Intel Corporation, Hillsboro, OR, USA, in 2012. He was with the IBM T. J. Watson Research Center, Yorktown Heights, NY, USA, as a Research Staff Member from 2013 to 2017. He has been with Samsung Research since 2017. His current research interests include DNN model compression, DNN accelerator design, low power circuit design, and on-chip memory design.
Data Analytics, Compression, and Management
Machine Learning, Deep Learning and Artificial Intelligence