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Xian Xiao received the B.S. and M.S. degrees from Tsinghua University, Beijing, China, in 2012 and 2015, respectively. He has been working toward the Ph.D. degree in electrical and computer engineering with the University of California, Davis, CA, USA, since 2015. He was a research intern with Nokia Bell Labs in the summer of 2016 and 2017, with Lawrence Berkeley National Laboratory from 2017 to 2018, and with Hewlett-Packard Labs in the summer of 2018. His current research interest includes silicon photonics, optical interconnects, 2.5D/3D photonic integration, and neuromorphic computing.
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