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Thermal Management of HPC Hardware Architectures via Immersion Cooling
Event Type
Exhibitor Forum
HPC Center Planning and Operations
Registration Categories
TimeWednesday, 18 November 20201pm - 1:30pm EDT
LocationTrack 7
DescriptionAs computing power continues to increase, air cooled systems can not meet current thermal requirements for HPC hardware systems. Power consumption, space and performance all must be considered during system design. Immersion cooling is a fast-growing solution to economically combat system heat, noise, power consumption and compute density. In this presentation, Samtec will discuss both novel immersion cooling techniques and observed results from testing across its interconnect product portfolio.
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