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BEGIN:VEVENT
DTSTAMP:20210402T160037Z
LOCATION:Track 7
DTSTART;TZID=America/New_York:20201118T130000
DTEND;TZID=America/New_York:20201118T133000
UID:submissions.supercomputing.org_SC20_sess329_exforum122@linklings.com
SUMMARY:Thermal Management of HPC Hardware Architectures via Immersion Coo
 ling
DESCRIPTION:Exhibitor Forum\n\nThermal Management of HPC Hardware Architec
 tures via Immersion Cooling\n\nNiehoff\n\nAs computing power continues to 
 increase, air cooled systems can not meet current thermal requirements for
  HPC hardware systems.  Power consumption, space and performance all must 
 be considered during system design. Immersion cooling is a fast-growing so
 lution to economically combat system heat, noise, power consumption and co
 mpute density.  In this presentation, Samtec will discuss both novel immer
 sion cooling techniques and observed results from testing across its inter
 connect product portfolio.\n\nTag: Datacenter, HPC Center Planning and Ope
 rations\n\nRegistration Category: Exhibits Reg Pass
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